The new trend in today's placement process is the requirement for reflow soldering to use more advanced heat transfer methods to achieve energy savings, uniform temperatures and to suit the soldering requirements of double-sided PCBs and new device packaging methods. reflow soldering oven Reflow quality has a very close relationship with the equipment and can directly affect the production process.
Conveyor width to meet the maximum PCB size requirements According to the PCB choose the width of the mesh belt: PCB 200MM mesh belt applications choose 300MM , general: 300 350 400 450 500MM 600MM choose the greater the width, reflow power will be greater, so choose the right is the most important.
Heating time of the solder paste The temperature of the reflow equipment should follow the requirements of the solder paste. Solder paste manufacturers usually provide a fairly wide window of time for the various stages of the reflow curve: 120 to 240 seconds for preheat and constant temperature, 60 to 120 seconds for reflow / time above the liquid state.
Length and number of heating zones The longer the heating zone length and the greater the number of heating zones, the easier it is to adjust and control the temperature profile. Generally small and medium-sized production choose 5-6 temperature zones, heating zone length of about 1.8m reflow furnace that can meet the requirements. In addition, the upper and lower heaters should be independently temperature controlled in order to adjust and control the temperature curve.
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